SKU:60812457613
Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD
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- USA
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- USA
- CAN
Ships within 48 hours · Estimated delivery Jul 13 - Jul 18
Description
Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LDEQ ECO 419 LD is a High strength film is for bonding wafer ( up to 6" Dia ) or thin substrate ( < 2. 0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with < 6" diameter vacuum chuck. SPECIFICATIONS: Width 6. 5" Thickness 0. 25mm Length Price sold by 10 feet per quantity Item It is the consumable part, replace the gasket each time assembly. It may cause a leak when reusing. Application Notes
the nozzle may stop spray with Vortex Shaper installed
2mm (D) x 5
Dimension:
Grinding calcined powder again by mortar
Polished: Two sides
Surface finish (RMS or Ra): < 10A
1mm or less in diameter(colored)
3" (60mm) (+/-1°C)
SIB-NFCN provides 120 mAh/g first discharge capacity
and CR2016 with an included die
which can be easily adapted onto the sample holder to clamp rod shape specimens with a diameter up to 1'' max
Hardness (HV): 100 +/- 20
Quick Dispatch:
Your Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD orders ship within 1-2 business days.
Delivery Options:
- Standard: 3-7 business days
- Fast: 2-3 business days
- Express: 1-2 business days
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Exchange/Return Notes
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- Final sale items are not eligible for returns or exchanges.
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